I.Technical Requirements
1.Thickness and width
In Microns
2.Performance
II. Application
6051-MT thermal conductive polyimide film has high dimensional stability and similar CTE to copper foil, so it is especially suitable for manufacturing copper clad laminate in FPC industry. In particular to a heat-conducting double-sided flexible copper clad laminate. The thermal conductive polyimide film improves the thermal conductivity of flexible copper clad laminate, reduces the thermal resistance, enhances the thermal conductivity and heat dissipation capacity, and expands the application range.
